Magigoo Glide for HT, 250 ml

Adhesive solution for high-temperature polymers

$235.51

(All prices excl. VAT. - Excludes delivery costs )

Model type : 250 ml

In stock from January 12

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Delivery estimated by Wednesday, 21 January

Features & Advantages

  • Special formulation for high-temperature polymers
  • Maximum adhesion under extreme conditions
  • Effective warping prevention
  • Temperature-dependent adhesion release

Item no.: T3D-MGHT2025, EAN: 5350583000214

Product information & technical details

  • Item no.: T3D-MGHT2025
  • Manufacturer No.: MGHT2025
  • Manufacturer: Magigoo
  • Product type: Adhesive
Description

Magigoo Glide HT is a highly specialised 3D print bed adhesive for professional FDM printing with high-temperature and high-performance materials such as PEEK, PEI (polyetherimide), PPSU, and other industrial polymers. These materials require extremely stable adhesion at consistently very high print bed and build chamber temperatures, where conventional adhesive solutions quickly reach their limits. The special HT formulation of Magigoo Glide HT is designed for maximum thermal stability and delivers a consistently strong, material-specific bond even at print bed temperatures exceeding 110°C up to 150°C and beyond. This reliably prevents warping, delamination, and print failures - including with large, solid, or highly stressed components with extreme internal stresses.

Glide HT ensures rock-solid adhesion throughout the entire printing process; however, after the print bed has cooled in a controlled manner, the adhesion weakens. This allows the parts to be removed cleanly and without damage from the build plate, which is a crucial advantage, especially when using expensive, high-performance filaments.

Features at a glance:

  • Developed for high-temperature polymers such as PEEK, PEI (polyetherimide), PPSU and other high-performance plastics,
  • Reliable adhesion at print bed temperatures above 110°C up to 150°C and above,
  • Stable, material-specific adhesive bond throughout the entire printing process,
  • It compensates for the extreme internal stresses of high-temperature-resistant polymers and prevents warping and delamination.
  • Strong adhesion during printing, controlled and clean component removal after cooling.
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