TermoPasty AG Copper Thermal Conductive Paste, 4 g - syringe

The TermoPasty AG Thermal Conductive Paste is a copper-based paste that ensures effective heat dissipation and brings your components to the right temperature, with an impressive ~3.1 W/mK thermal conductivity.

Strong cooling performance

Thanks to high-quality copper connections, the paste reliably fills microscopically small imperfections between the processor and heat sink, ensuring even heat transfer. Particularly in combination with copper heat sinks, it displays its full potential and ensures maximum system performance.

Excellent thermal stability

Thanks to its high thermal stability, the paste can easily withstand temperatures ranging from -50°C to +250°C - and even up to 340 °C for short periods. Ideal for high-end systems, demanding electronics and industrial applications. The viscosity prevents unwanted flow, while the thixotropy index (380 ± 10) enables super-precise application.

Excellent dielectric properties

With a density of around ~2.9 g/cm³, the paste does not evaporate and stays where it belongs for a long time. It also boasts excellent dielectric properties, i.e. perfect electrical insulation with a volume resistance of 3.8 x 10¹⁴ Ohm x cm.

Do not combine with aluminium!

Using the paste with aluminium heat sinks can lead to galvanic corrosion. If you are working with aluminium, we recommend using the eXtreme Thermal Conductive Paste.